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1 sheet no.: op08905 july, 2009 ?sharp corporation gp1usc3xxp (series) gp1usc3xxp (series) infrared detector for remote control notice the content of this data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. preliminary features 1. compact size: (mounting area 5.0 4.5; and 1.35 mm tall) 2. smd (surface mount device), reflow capable 3. low power dissipation: 0.6 ma max. 4. wide operating temperature range: -30 to + 85c 5. five parts, offering a number of center frequencies: agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 12. applications 1. automotive audio 2. personal computers 3. audio visual equipment part number center bandpass frequency (typ.) GP1USC30XP 36 khz gp1usc31xp 38 khz gp1usc32xp 36.7 khz gp1usc33xp 32.75 khz gp1usc34xp 40 khz
sheet no.: op08905 july, 2009 2 gp1usc3xxp series preliminary external dimensions 1.1 0.9 0.9 2.7 1.1 2.0 2.2 4.5 1.35 0.9 0.9 2.25 2.25 2.6 2.2 (0.9) 5.0 2.4 g n d vo u t vcc g n d pd center 1.1 1.1 gp1usc3xp-1 notes: 1. units: mm 2. unspecified tolerance: 0.3 3. case and lead material: c u (a u , pd plating) 4. mold resin: epoxy resin 5. prod u ct mass: approx 0.06 g r0 GP1USC30XP r 4 9 7 1 4 day (01 - 31) month (1 - 9, x, y, z) year (2009: 9) model nu m b er gp1usc31xp gp1usc32xp gp1usc33xp r1 r2 r3 gp1usc34xp r4 model no. stamp marking area
sheet no.: op08905 july, 2009 3 gp1usc3xxp series preliminary block diagram absolute maximum ratings * 1 non-condensing: humidity kept above dew point. * 2 255c is a peak maximum value when flow-soldering; for hand soldering, 230c and apply heat no more than 40 seconds. parameter symbol rating unit notes supply voltage v cc 0 to 6 v operating temperature topr -30 to +85 c *1 storage temperature tstg -40 to +85 c soldering temperature tsol 255 (peak) 230 c *2 amp oscillator control circ u it amp b.p.f. demod u lator integrator comparator r l g n dv cc v out gp1usc3xp-4
sheet no.: op08905 july, 2009 4 gp1usc3xxp series preliminary electro-optical characteristics * 1 the waveform shown in fig. 1 was transmitted at the test part?s center frequency. reception measurements were begun at transmission start and ended at pulse 50. parameter symbol condition min. typ. max. unit operating supply voltage v cc 2.7 5.5 v current dissipation i cc e v = 0 lx (no light) ? 0.35 0.6 ma output high voltage v oh see note 1 v cc ? 0.5 ? ? v output low voltage v ol i ol = 1.6 ma *1 ?0.45 v output high pulse width t 1 see figure 2 600 1200 s output low pulse width t 2 see figure 2 400 1000 s bandpass frequency center ?o GP1USC30XP 36 khz gp1usc31xp 38 khz gp1usc32xp 36.7 khz gp1usc33xp 32.75 khz gp1usc34xp 40 khz output pullup resistance r l 50 k ? fig. 1. transmitted and received pulses 600 s 1000 s transmitted signal o u tp u t signal t 2 t 1 gp1usc3xp-5
sheet no.: op08905 july, 2009 5 gp1usc3xxp series preliminary performance measurements the parameters in the characteristics tables were gathered using the transmitter jig in fig. 2, along with the receiver jig in fig. 3. 1. linear reception: distance between transmitter and receiver: 0.2 to 15.0 meters; detector face illu- mination: ev < 10 lx, ? = 0 2. reception angle sensitivity: distance between transmitter and receiver: 0.2 to 12 meters; detector face illumination: ev < 10 lx, ? ? 30 3. transmitter test setup: in fig. 2, the transmitter is set so that v out will be 180 m v p-p. the pd49pi has a short-circuit current i sc = 2.6 a at ev = 100 lx. fig. 2. transmitter test setup fig. 3. receiver test setup transmitter ? o: ( n ote 1) d u ty cycle: 50% pd49i note: 1. the bpf center fre qu ency ? o v aries w ith model, as sho w n in the electro-optical characteristics oscilloscope 10 k 10 f 10 k +5 v 20 cm v out gp1usc3xp-6 v out reception distance: l transmitter detector face ill u minance: e v note: : indicates horizontal and v ertical directions gp1usc3xp-7
sheet no.: op08905 july, 2009 6 gp1usc3xxp series preliminary design considerations design guidelines 1. this product is not designed to be electromagnetic- and ionized-particle-radiation resistant. 2. avoid placing mechanical stress upon this part, whether to the case or terminals. such stresses may crack the molding material, possibly breaking internal wire bonds in the part. 3. conductive thermoplastics are used in the second mold resin of this part. do not allow this resin to come in con- tact with the pcb landing or any circuit runs. 4. when using this part in a remote control detector, the incoming signal must be managed so that tdata is less than 100 ms and toff (suspend time) is more than 25 ms; and the minimum pulse width of modulated ir data is 250 s during ton. should the signal format fail to meet these conditions, the reception distance or device output may be compromised. see fig. 4. 5. output noise may be caused by environmental factors, even in the absence of a received signal. if the device is used in the presence of strong external light, this may show up as noise in the detector. sharp recommends checking the layout and structure so as to reduce the amount of external light interference. also, confirm the device?s performance in actual operation, as the output may be affected by signal format, temperature, and the distance from the transmitter. 6. this device may have degraded optical performance if the detector surface becomes dirty or coated with any foreign substance. this may happen through the use of process chemicals, including washing; it is for this rea- son that sharp does not recommend washing this part. if the detector surface becomes contaminated, use a soft cloth to wipe it clean. 7. sharp recommends a circuit similar to the one shown in fig. 5 to accompany this device. the values should be adjusted to reflect the actual circuit conditions, and be placed as physically close to the device as possible. fig. 4. transmit time for one signal block fig. 5. device connection . . . . . . . . . . . . t on transmitting time for 1 block: t data period: tdata suspendx period: t off gp1usc3xp-2 + v cc c 1 r 1 notes: r 1 = 47 5% c 1 = 47 f v out g n d v o v e g n d gp1usc3xp-3
sheet no.: op08905 july, 2009 7 gp1usc3xxp series preliminary 8. this device has a parallel transistor internally to protect it against static. however, the internal protection should not be counted upon to protect the device against overvoltage or noise spikes in the power supply, as the transistor could experience a secondary breakdown short. sharp recommends decoupling the power supply near the device with a 47 ? (1/10 w) resistor and 10 f capacitor. 9. this part is not highly tolerant of condensing conditions. condensation can degrade the case and lead connec- tions, leading to degraded electrical characteristics. manufacturing guidelines storage and handling 1. moisture-proofing: these parts are shipped in vacuum-sealed packaging to keep them dry and ready for use. 2. store these parts between 10c and 30c, at a relative humidity of less than 70 % , for up to a year. 3. after breaking the package seal, maintain the environment within 10c to 30c, at a relative humidity of less than 70 % . mount the parts within 2 days. 4. if the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant. store them as above, but since the seal has been broken, the parts must be used within 4 weeks. 5. if the parts are exposed to air for more than 3 days, if there are more than 3 days between reflow operations, or if the silica gel telltale indicates moisture contamination, bake the parts. if these parts will undergo a second reflow operation, and if they have exceeded the open time as noted above, they must be baked. in all cases, these parts may be baked only once: ? when in the tape carrier, bake them at a temperature of 65c for 48 hours. bake only one reel at a time; reels will become deformed if stacked. ? when loose on a metal tray or on a pcb, bake them at a temperature of 100c to 110c, for 12 to 24 hours. temporary mounting on a pcb must be using an adhesive and not by soldering. baking these particular parts in the reels is to be avoided if at all possible. to properly bake these parts, they should be mounted to a pcb with adhesive (not soldered) or placed in a metal tray.
sheet no.: op08905 july, 2009 8 gp1usc3xxp series preliminary soldering instructions 1. sharp recommends soldering this part no more than twice and at the profile shown in fig. 6. reflow should occur within three days, after storing at 10c to 30c, and at no more than 70 % relative humidity. 2. when preheating this part with infrared, localized high temperatures can be generated in the resin of this part; therefore the process should be confirmed that it remains within the limits shown in fig. 6. 3. when hand soldering, use a temperature-controlled iron with the point < 350c < 5 seconds. 4. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the device due to the pcb flexing during the soldering process. 5. sharp recommends handling this part in a static-controlled work area. soldering mask fig. 7 shows the recommended solder mask for this device. fig. 6. soldering profile gp1usc3xp- 8 90 30 s 40 s max. 1 - 3c/s 255c max. 230c 1 8 0c 150c 25c 1 - 3c/s 1 - 5c/s fig. 7. soldering mask 2.0 5.7 gp1usc3xp-13 2.0 0.7 1. 8 1.3 1.3 2.0 1.7 2.0 v cc v out 0.9 1.3 1.3 4.9 2.3 g n dg n d
sheet no.: op08905 july, 2009 9 gp1usc3xxp series preliminary cleaning instructions 1. if the detector face becomes contaminated, the optical characteristics of this part will be affected. do not wash this part, as residue left from solvents may be left behind. only clean the part with a soft cloth. 2. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. tape specifications fig. 8 tape shape and dimensions gp1usc3xp-9 12.0 0.30 5.50 0.10 1.75 0.10 8 .0 0.10 2.0 0.05 4. 8 0.10 4.0 0.10 5.3 0.10 1.65 0.10 1.5 1.5 min +0.10 -0.00
sheet no.: op08905 july, 2009 10 gp1usc3xxp series preliminary reel specifications product insertion direction fig. 10 shows the orientation of the device in the tape. fig. 9 reel shape and dimensions g gp1usc3xp-10 21.0 0. 8 13.0 0.2 1 8 .5 1.0 100.0 1.0 254.0 1.0 13.5 1.0 fig. 10 product insertion indicator la b el chip p u ll o u t gp1usc3xp-11
sheet no.: op08905 july, 2009 11 gp1usc3xxp series preliminary packing information product is sealed in laminated aluminum bags with 2000 pieces per reel, silica gel desiccant, and humidity telltale. the eiaj c-3 compliant label is filled out and affixed to the bag. four of these packaged reels of product are then placed in the shipping box with pads separating them, as well as a pad on both the top and bottom. the boxes are then sealed with kraft tape, indicating number, quantity, and lot number. each box carries 8000 pieces for a total mass of approximately 2 kg; the mass of each part is approximately 0.05 g. fig. 11 shipping package drawing silica gel taped prod u ct in reel la b el damp proof bag la b el tape-reel in a moist u re-proof bag packing case packing case la b el 370 mm typ. 440 mm typ. 150 mm typ. pad (5 sheets total) reels in moist u re-proof bags indicator gp1usc3xp-12 notes: 1. units: mm 2. q u antity: 8 000 pcs/package 4. reg u lar packaged mass: approximately 2.0 kg 5. shipping la b el: model n o., q u antity, and lot n o.
sheet no.: op08905 july, 2009 12 gp1usc3xxp series preliminary presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachloride, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic information products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. category toxic and hazardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromium (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared detectors ??????
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data materials, struc- ture, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- v arious safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: op008905 july 2009 13 gp1usc3xxp series preliminary

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